EVENT

■ 2002 JSPE Spring Conference ■
　
The Japan Society for Precision Engineering will provide 2002 spring conference at Tokyo Institute of Technology. The organized session for the "Planarization / CMP Technology" will be held at the conference. We look forward to your participation.
　
▼ 2002 JSPE Spring Conference
　
　Date: March 28, 2002 (Thu) - 30 (Sat)
　
　Place: Tokyo Institute of Technology Ookayama Campus (Ookayama, Meguro-ku, Tokyo)
　
▼ Organized Session " Planarization CMP ant its Applications "
　
　Date: March 30 (Sat), 2002
　
　Place: Tokyo Institute of Technology ( K room)
　
■ Program
▼ Planarization CMP ant its Applications （1）
9:00　K61 Keynote Speech Univ. of Arizona
Role of Slurry Flow Rate and Solids Content on Critical Dr. Ara Philipossian
Tribological and Fluid Dynamics Attibutes of ILD CMP
9:40　K63 Improvement on dynamic stability of Silica sulurry Rodel Nitta Rodel Nitta
K. Ohta et al.
10:00　K64 Improvement on polishing performance in W-CMP sulurry Rodel Nitta
Y. Itai et al.
10:20　K65 Mirror polishing for Metal Cu（5）
- Basic properties on CMP for Cu film on LSI device's electrode material and on polishing for Cu Null aspheric mirror -		 Saitama Univ.
A. Hirao et al.
▼ Planarization CMP ant its Applications （2）
11:00　K67 Reduction on slurry consumption in CMP Mitsubishi Mateerials
H. Kobayashi et al.
11:20　K68 Study on CMP processing with polishing tape
- 2nd report Improvement on surface roughness - 		Shinshu Univ.
T. Uchida et al
11:40　K69 Application on polishing film made from aggromerated abrasives for CMP Ricoh Jun et al.
▼ Planarization CMP ant its Applications （3）
13:00　K73 Development on fixed-abrasive CMP(FX-CMP) for STI
- 2nd report Decreasing scratches with pore control -		 Hitachi K. Yasui et al.
13:20　K74 Development on fixed-abrasive CMP(FX-CMP) for STI
- 3nd report Investigation on uniformity in polishing-		 Hitachi S. Katagiri et al
13:40　K75 Technology development for 300mm Cu- CMP Selete K. Suzuki et al.
▼ Planarization CMP ant its Applications （4）
14:20　K77 Novel Belljar type CMP machine and its polishing performance
- 1st report Propose for Belljar type CMP method and its performance-		 Ssaitama Univ.
T. Doy et al.
14:40　K78 Study on laser assisted CMP Sony
- 4th report Characteristics on polishing at micro bumped area -		 K.Kimura et al.
15:00　K79 Application on surface horning to Opto-Electric parts Matsushita
K. Nishihara et al.
15:20　K80 Development on swing and speed control type of continuous grinding and polishing machine
- 6th report Investigation on factors influencing for grinding geometry -		 Defense Academy
H. Sugiura et al.
▼ Planarization CMP ant its Applications （5）
16:00　K82 Influence on visco-elastic recovery behavior of polisher on roll-off of Silicon wafer
- 2nd report Development on evaluation instrument and evaluation polishers -		 Toshiba
K. Masunaga et al.
16:20　K83 Influence on visco-elastic recovery behavior of polisher on roll-off of Silicon wafer
- 3rd report Mathematical modeling method for visco-elasticity of polishers - 		Toshiba
N. Nakamura et al.
16:40　K84 Development on ultra high precision planarity measuring instrument Matsushita
K. Kubo et al.
17:00　K85 Geometry correction for large sized wafer with polishing
- Polishing pressure analysis with FEM -		 Defense Academy
K. Yoshitomi et al.
17:20　K86 Polishing with swing motion with single wafer type machine
- 4th report Polishing geometry at constant speed polishing with swing motion - 		Defense Academy
A. Une et al.
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